CLGA Arkusz danych(PDF) - Amkor Technology

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CLGA Arkusz danych (PDF) - Amkor Technology

CLGA Datasheet PDF - Amkor Technology


Numer części	CLGA

Pobierz	CLGA Pobierz

Rozmiar pliku	357.67 Kbytes

Page	1 Pages

Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

Logo

Szczegółowy opis

Ceramic Land Grid Array Package

CLGA Datasheet (PDF)

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Pobierz Arkusz danych

CLGA Datasheet PDF - Amkor Technology


Numer części	CLGA

Pobierz	CLGA Click to download

Rozmiar pliku	357.67 Kbytes

Page	1 Pages

Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

Logo

Szczegółowy opis	Ceramic Land Grid Array Package

CLGA Arkusz danych (HTML) - Amkor Technology

CLGA Datasheet HTML 1Page - Amkor Technology

Podobny numer części - CLGA

Producent	Numer części	Arkusz danych	Szczegółowy opis
Mean Well Enterprises C...	CLG-100	218Kb / 2P	100W Single Output Switching Power Supply
	CLG-100	99Kb / 1P	30~60W Single Output with PFC
	CLG-100	247Kb / 3P	100W Single Output Switching Power Supply
	CLG-100	247Kb / 3P	100W Single Output Switching Power Supply
	CLG-100	250Kb / 3P	100W Single Output Switching Power Supply

Podobny opis - CLGA

Producent	Numer części	Arkusz danych	Szczegółowy opis
National Semiconductor ...	U99A	65Kb / 1P	99 Pin Ceramic Pin Grid Array NS Package Number U99A
STATS ChipPAC, Ltd.	FLGA	515Kb / 2P	Fine Pitch Land Grid Array
STATS ChipPAC, Ltd.	FLGA-SD	537Kb / 2P	Fine Pitch Land Grid Array - Stacked Die
National Semiconductor ...	U84C	71Kb / 1P	84 Pin Ceramic Pin Grid Array
National Semiconductor ...	U120A	69Kb / 1P	120 Pin Ceramic Pin Grid Array
fujitsu semiconductor	BGA-320P-M06	34Kb / 1P	PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
Amkor Technology	CPGA	533Kb / 1P	Ceramic Pin Grid Array Package
Amkor Technology	PPGA	304Kb / 1P	Plastic Pin Grid Array Package
Maxim Integrated Produc...	90-0171	28Kb / 1P	PACKAGE LAND PATTERN, (U28) 4.4MM TSSOP Rev B
Maxim Integrated Produc...	90-0360	63Kb / 1P	PACKAGE LAND PATTERN, (G2044Y1) Rev A

O Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Niniejsze informacje służą wyłącznie celom informacyjnym, nie ponosimy odpowiedzialności za jakiekolwiek straty lub szkody spowodowane przez powyższe informacje.

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