FCCSP Arkusz danych(PDF) - Amkor Technology

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FCCSP Arkusz danych (PDF) - Amkor Technology

FCCSP Datasheet PDF - Amkor Technology


Numer części	FCCSP

Pobierz	FCCSP Pobierz

Rozmiar pliku	119.83 Kbytes

Page	2 Pages

Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

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Szczegółowy opis

a flip chip solution in a CSP package format.

FCCSP Datasheet (PDF)

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Pobierz Arkusz danych

FCCSP Datasheet PDF - Amkor Technology


Numer części	FCCSP

Pobierz	FCCSP Click to download

Rozmiar pliku	119.83 Kbytes

Page	2 Pages

Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

Logo

Szczegółowy opis	a flip chip solution in a CSP package format.

FCCSP Arkusz danych (HTML) - Amkor Technology

FCCSP Datasheet HTML 1Page - Amkor Technology

FCCSP Datasheet HTML 2Page - Amkor Technology

Podobny numer części - FCCSP

Producent	Numer części	Arkusz danych	Szczegółowy opis
Amkor Technology	FCCSP	411Kb / 2P	Silver Wirebonding 02/22
Amkor Technology	FCCSP	953Kb / 2P	Amkor Technology offers the Flip Chip CSP (fcCSP) package – a flip chip solution in a CSP package format. 04/20

Podobny opis - FCCSP

Producent	Numer części	Arkusz danych	Szczegółowy opis
Semtech Corporation	SFC05-4	174Kb / 7P	CSP TVS Flip Chip TVS Diode Array
California Micro Device...	CSPRC030	44Kb / 3P	CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
California Micro Device...	CSPRC032	44Kb / 3P	CHIP SCALE PACKAGE(CSP) EMI FILTER NETWORK
Cirrus Logic	CS98000	420Kb / 46P	DVD On-a-Chip Solution
Yamaichi Electronics Co...	NP284-26409N	82Kb / 1P	Chip Scale Package (CSP, 0.50mm Pitch)
Yamaichi Electronics Co...	NP383-18010-N	174Kb / 1P	Chip Scale Package -TH (CSP, 0.50mm Pitch)
Texas Instruments	SN74F574DWRE4	641Kb / 13P	Eight D-Type Flip-Flops in a Single Package
Formosa MS	QRDM-CSP01	905Kb / 1P	Flip Chip CSP DIODE
Lumileds Lighting Compa...	PB116	1Mb / 2P	High current density Chip Scale Package (CSP) LED
NXP Semiconductors	MF0FCP2U1	66Kb / 5P	Flip chip package Rev. 3.1-8 February 2007

O Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Niniejsze informacje służą wyłącznie celom informacyjnym, nie ponosimy odpowiedzialności za jakiekolwiek straty lub szkody spowodowane przez powyższe informacje.

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