LCC Arkusz danych(PDF) - Amkor Technology

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LCC Arkusz danych (PDF) - Amkor Technology

LCC Datasheet PDF - Amkor Technology


Numer części	LCC

Pobierz	LCC Pobierz

Rozmiar pliku	459.94 Kbytes

Page	1 Pages

Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

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Szczegółowy opis

Leadless Chip Carrier Package

LCC Datasheet (PDF)

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Pobierz Arkusz danych

LCC Datasheet PDF - Amkor Technology


Numer części	LCC

Pobierz	LCC Click to download

Rozmiar pliku	459.94 Kbytes

Page	1 Pages

Producent	AMKOR [Amkor Technology]

Strona internetowa	http://www.amkor.com

Logo

Szczegółowy opis	Leadless Chip Carrier Package

LCC Arkusz danych (HTML) - Amkor Technology

LCC Datasheet HTML 1Page - Amkor Technology

Podobny numer części - LCC

Producent	Numer części	Arkusz danych	Szczegółowy opis
Vishay Siliconix	LCC	153Kb / 4P	Hermetic, 50 Mil Pitch, Leadless Chip Resistor Networks 31-Jul-08
HolyStone International	LCC	205Kb / 2P	Large Size NP0 & X7R MLCC Capacitors
Vishay Siliconix	LCC	122Kb / 4P	Hermetic, 50 mil Pitch, Leadless Thin Film Chip Resistor 14-Jul-16
List of Unclassifed Man...	LCC-16J2	88Kb / 1P	LCD Character Module 16 x 2
List of Unclassifed Man...	LCC-20K4	105Kb / 1P	LCD Character Module 20 x 4

Podobny opis - LCC

Producent	Numer części	Arkusz danych	Szczegółowy opis
Compensated Deuices Inc...	CDLL3821	22Kb / 2P	LEADLESS PACKAGE FOR SURFACE MOUNT
	CDLL4099	96Kb / 2P	LEADLESS PACKAGE FOR SURFACE MOUNT
	CDLL746	25Kb / 2P	LEADLESS PACKAGE FOR SURFACE MOUNT
National Semiconductor ...	MKT-E32B	31Kb / 1P	LEADLESS CHIP CARRIER, TYPE C, 32 TERMINAL
Microsemi Corporation	1N4614UR-1	122Kb / 2P	LEADLESS PACKAGE FOR SURFACE MOUNT
Vishay Siliconix	PL340	140Kb / 2P	Plastic Leadless Chip Carrier 14-Nov-02
Microsemi Corporation	1N746AUR-1	44Kb / 2P	LEADLESS PACKAGE FOR SURFACE MOUNT
Microsemi Corporation	BZV55C7V5	24Kb / 1P	LEADLESS PACKAGE FOR SURFACE MOUNT
TT Electronics.	BCN31	274Kb / 3P	Leadless Chip Packages
Analog Devices	HMC557A	348Kb / 23P	24-terminal ceramic leadless chip carrier package REV. C

O Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Niniejsze informacje służą wyłącznie celom informacyjnym, nie ponosimy odpowiedzialności za jakiekolwiek straty lub szkody spowodowane przez powyższe informacje.

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