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SWIFT Arkusz danych (PDF) - Amkor Technology

SWIFT Datasheet PDF - Amkor Technology
Numer części SWIFT
Pobierz  SWIFT Pobierz
Rozmiar pliku   1342.31 Kbytes
Page   2 Pages
Producent  AMKOR [Amkor Technology]
Strona internetowa  http://www.amkor.com
Logo AMKOR - Amkor Technology
Szczegółowy opis Silicon Wafer Integrated Fan-out Technology (SWIFT) is designed to provide increased I/O and circuit density in a reduced footprint and profile for single and multi-die applications.

SWIFT Datasheet (PDF)

Go To PDF Page Pobierz Arkusz danych
SWIFT Datasheet PDF - Amkor Technology

Numer części SWIFT
Pobierz  SWIFT Click to download

Rozmiar pliku   1342.31 Kbytes
Page   2 Pages
Producent  AMKOR [Amkor Technology]
Strona internetowa  http://www.amkor.com
Logo AMKOR - Amkor Technology
Szczegółowy opis Silicon Wafer Integrated Fan-out Technology (SWIFT) is designed to provide increased I/O and circuit density in a reduced footprint and profile for single and multi-die applications.

SWIFT Arkusz danych (HTML) - Amkor Technology


SWIFT Szczegóły Produktu

FEATURES
Polymer dielectrics
Multi-die and large die capability
Large body package capability
Interconnect density down to 2/2 μm
Cu pillar die interconnect down to 30 μm pitch
Meets JEDEC MSL2a and MSL3 CLR and BLR requirements




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O Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*Niniejsze informacje służą wyłącznie celom informacyjnym, nie ponosimy odpowiedzialności za jakiekolwiek straty lub szkody spowodowane przez powyższe informacje.




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