DESCRIPTION
Halide-free activated resin flux conforming to DIN EN 29454-1 Type 2.2.3 (DIN 8511 F-SW 34) with non-corrosive residues as
per DIN 8527.
Stannol 500-3429 exhibits good wetting of the solder despite the low solid content. After soldering residues are dry and
transparent. They build up a visible uniform layer. Stannol 500-3429 was designed for the use in double wave soldering
machines especially to solder SMD components.
APPLICATION
Stannol 500-3429 is suitable for foam or spray fluxers. The preheat temperature should be adjusted to 100°C at the top side
of the board before entering the wave to get optimum results. Depending on the board design other temperatures may be
possible.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.