Designed for 30 x 30 mm BGA components
superGRIPTM super strong, uniform attachment force helps achieve
maximum performance from phase-changing TIM and does not require
holes in the PCB
Allows the heat sink to be detached and reattached without damaging the
component and/or the PCB, an important feature in the event a PCB may
need to be reworked
Meets Telcordia GR-63-Core Office Vibration, ETSI 300 019
Transportation Vibration, and MIL-STD-810 Shock Testing and
Unpackaged Drop Testing standards
Requires minimal space around the component’s perimeter; ideal for
densely populated PCBs
“Keep-Out” Requirements: An “Un-Populated” boarder zone of 3 mm
around the component is necessary to facilitate the Installation/Removal of
the superGRIP™. Please refer to the superGRIP™ Keep-Out Guidelines
and superGRIP™ Installation/Removal Instructions for further details