DS_UMFT311GP pdf, DS_UMFT311GP Szczegółowy opis, DS_UMFT311GP Arkusz danych, DS

Numer części	DS_UMFT311GP

Szczegółowy opis	DS_UMFT311GP shield board to be used with FT311D Development Module.

Rozmiar pliku	835.66 Kbytes

Html View	1 2 3 4 5 6 7 8 9 Next

Producent	FTDI [Future Technology Devices International Ltd.]

Strona internetowa	http://www.ftdichip.com

Logo

Podobny numer części - DS_UMFT311GP

Producent	Numer części	Arkusz danych	Szczegółowy opis
Future Technology Devic...	DS_UMFT311EV	827Kb / 16P	The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.

Producent	Numer części	Arkusz danych	Szczegółowy opis
Future Technology Devic...	DS_UMFT311EV	827Kb / 16P	The FT311D Development Module is a development module which utilises the FT311D IC to develop USB accessories connecting to Android platforms via Android Open Accessory mode.
Advantech Co., Ltd.	ROM-DB3900	514Kb / 2P	Development board for RISC RTX2.0 Module
Advantech Co., Ltd.	ROM-DB7500	571Kb / 2P	Development board for RISC Qseven Module
Ironwood Electronics.	LS-BGA520C-05	98Kb / 1P	To be used with GHz sockets
	TS-SG-01-3.0	81Kb / 1P	To be used with swivel lid sockets
	TS-SG-02-0.5	29Kb / 1P	To be used with swivel lid sockets
	TS-SS-03-0.5	74Kb / 1P	To be used with Clamshell lid sockets
	TS-SS-11-3.0	82Kb / 1P	To be used with clamshell lid sockets
	TS-SS-12-0.5	101Kb / 1P	To be used with clamshell sockets
Advantech Co., Ltd.	ROM-DB7502	460Kb / 2P	Development Board for Qseven2.0/2.1 Module 9-Aug-2018