| Zakładka z wyszukiwarką danych komponentów |
|
LRG6SP Arkusz danych(PDF) 12 Page - OSRAM GmbH |
|
|
|||||||||||||||||||||||||||||
LRG6SP Arkusz danych(HTML) 12 Page - OSRAM GmbH |
|
12 / 21 page ![]() 2017-06-27 12 Version 1.0 LR G6SP - Dual Binning Recommended Solder Pad 8) page 20 Reflow soldering Empfohlenes Lötpaddesign 8) Seite 20 Reflow-Löten Note: For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Anm.: Um eine verbesserte Lötstellenkontaktierung zu erreichen, empfehlen wir, unter Standard- Stickstoffatmosphäre zu löten. Das Gehäuse ist für Ultraschallreinigung nicht geeignet. Package marking 0.6 (0.024) Lötstopplack Solder resist 0.35 (0.014) A A min 9 mm per anode pad for improved heat dissipation C A A 2 0.8 (0.031) OHLPY925 0.35 (0.014) 0.8 (0.031) Package marking |
|
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |