Contents

SPBTLE-1S

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DocID030445 Rev 3

Contents

1

General description......................................................................... 5

2

Block schematic .............................................................................. 6

3

Software development .................................................................... 7

3.1

Software development Kit ................................................................. 7

3.2

Software architecture ........................................................................ 7

4

Hardware specifications ............................................................... 10

4.1

Current consumption ....................................................................... 10

4.2

Pin assignment................................................................................ 12

4.3

Mechanical dimensions ................................................................... 14

5

Hardware design ........................................................................... 16

5.1

Reset circuitry ................................................................................. 16

5.2

Debug interface............................................................................... 16

5.3

Reflow soldering.............................................................................. 17

6

Regulatory compliance ................................................................. 18

6.1

FCC certification.............................................................................. 18

6.1.1

Labeling instructions......................................................................... 18

6.1.2

Product manual instructions ............................................................. 18

6.2

IC certification ................................................................................. 19

6.2.1

Labeling instructions......................................................................... 20

6.2.2

Product manual instructions ............................................................. 20

6.3

SRRC .............................................................................................. 21

6.3.1

Modular approval.............................................................................. 21

6.3.2

Labeling instructions......................................................................... 21

6.4

Bluetooth certification...................................................................... 21

7

CE certification .............................................................................. 22

8

Ordering information..................................................................... 23

9

ECOPACK®.................................................................................... 24

10

Traceability .................................................................................... 25

11

Revision history ............................................................................ 26