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ST25DV64K Arkusz danych(PDF) 187 Page - STMicroelectronics |
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ST25DV64K Arkusz danych(HTML) 187 Page - STMicroelectronics |
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187 / 220 page ![]() DocID027603 Rev 4 187/220 ST25DV04K ST25DV16K ST25DV64K Package information 219 e - 0.500 - 0.0197 K 0.300 - - 0.0118 - - L 0.300 - 0.500 0.0118 - 0.0197 L1 - - 0.150 - - 0.0059 L3 0.300 - - 0.0118 - - aaa - - 0.150 - - 0.0059 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee(3) - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 3. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from measuring. Table 218. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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