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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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PC755 Arkusz danych(PDF) 19 Page - ATMEL Corporation |
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PC755 Arkusz danych(HTML) 19 Page - ATMEL Corporation |
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19 / 50 page  19 PC755/745 2138D–HIREL–06/03 Thermal Management Information This section provides thermal management information for the ceramic ball grid array (BGA) package for air-cooled applications. Proper thermal control design is primarily dependent upon the system-level design-the heat sink, airflow and thermal interface material. To reduce the die-junction temperature, heat sinks may be attached to the package by several methods-adhesive, spring clip to holes in the printed-circuit board or package, and mounting clip and screw assembly; see Figure 7. This spring force should not exceed 5.5 pounds of force. Figure 7. Package Exploded Cross-Sectional View with Several Heat Sink Options Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Adhesive or Thermal Interface Material Heat Sink Heat Sink Clip Printed ± Circuit Board Option BGA Package |
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