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LAG6SP Arkusz danych(PDF) 12 Page - OSRAM GmbH |
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LAG6SP Arkusz danych(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page ![]() LA G6SP 12 Version 1.3 | 2018-02-01 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 8) Package marking 0.6 (0.024) Lötstopplack Solder resist 0.35 (0.014) A A min 9 mm per anode pad for improved heat dissipation C A A 2 0.8 (0.031) OHLPY925 0.35 (0.014) 0.8 (0.031) Package marking |
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