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LAM67F Arkusz danych(PDF) 12 Page - OSRAM GmbH |
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LAM67F Arkusz danych(HTML) 12 Page - OSRAM GmbH |
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12 / 22 page ![]() LA M67F 12 Version 1.5 | 2018-04-13 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. Recommended Solder Pad 9) OHLPY978 Paddesign for improved heat dissipation Cu-area > 16 mm Cu-Fläche > 16 mm Wärmeableitung Padgeometrie für verbesserte Lötstopplack Solder resist 0.8 (0.031) 2.8 (0.110) 2 2 2.8 (0.110) 0.8 (0.031) |
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