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IXTH1N250 Arkusz danych(PDF) 2 Page - IXYS Corporation |
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IXTH1N250 Arkusz danych(HTML) 2 Page - IXYS Corporation |
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2 / 5 page ![]() IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXTH1N250 IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2 by one or moreof the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2 4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537 Symbol Test Conditions Characteristic Values (T J = 25°C, Unless Otherwise Specified) Min. Typ. Max. g fs V DS = 50V, ID = 0.5A, Note 1 1.0 1.8 mS C iss 1660 pF C oss V GS = 0V, VDS = 25V, f = 1MHz 77 pF C rss 23 pF t d(on) 69 ns t r 25 ns t d(off) 132 ns t f 39 ns Q g(on) 41 nC Q gs V GS = 10V, VDS = 600V, ID = 0.5A 8 nC Q gd 16 nC R thJC 0.50 °C/W R thCS 0.21 °C/W Source-Drain Diode Symbol Test Conditions Characteristic Values (T J = 25°C, Unless Otherwise Specified) Min. Typ. Max. I S V GS = 0V 1.5 A I SM Repetitive, Pulse Width Limited by T JM 6 A V SD I F = 1A, VGS = 0V, Note 1 1.5 V t rr I F = 1A, -di/dt = 100A/μs, VR = 200V 2.5 μs Resistive Switching Times V GS = 10V, VDS = 0.5 • VDSS, ID = 1A R G = 5Ω (External) Dim. Millimeter Inches Min. Max. Min. Max. A 4.7 5.3 .185 .209 A 1 2.2 2.54 .087 .102 A 2 2.2 2.6 .059 .098 b 1.0 1.4 .040 .055 b 1 1.65 2.13 .065 .084 b 2 2.87 3.12 .113 .123 C .4 .8 .016 .031 D 20.80 21.46 .819 .845 E 15.75 16.26 .610 .640 e 5.20 5.72 0.205 0.225 L 19.81 20.32 .780 .800 L1 4.50 .177 ∅P 3.55 3.65 .140 .144 Q 5.89 6.40 0.232 0.252 R 4.32 5.49 .170 .216 e ∅ P TO-247 (IXTH) Outline 1 2 3 Terminals: 1 - Gate 2 - Drain 3 - Source Note 1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%. *Additional provisions for lead to lead voltage isolation are required at V DS > 1200V. |
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