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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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LAW5AM Arkusz danych(PDF) 11 Page - OSRAM GmbH |
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LAW5AM Arkusz danych(HTML) 11 Page - OSRAM GmbH |
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11 / 16 page  Vorläufige Daten / Preliminary Data LR W5AM, LA W5AM, LY W5AM 2009-06-19 11 Empfohlenes Lötpaddesign 6) Seite 16 Reflow Löten Recommended Solder Pad 6) page 16 Reflow Soldering Solder resist Bare Copper Freies Kupfer Lötpasten Schablone Solder paste stencil Lötstopplack OHPY3637 Kupfer Copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 Lötstellen 3 solder points Thermal enhanced PCB Thermisch optimiertes PCB ø4.0 (0.157) Heatsink attach ø4.0 (0.157) ø2.5 (0.098) 1 (0.039) Footprint Empfohlene Padgeometrie Recommended Solder Pad Design Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected |
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