MP2233 datasheet(2/18 Pages) MPS

2 / 18 page

MP2233 – SYNCHRONOUS, STEP-DOWN CONVERTER WITH INTERNAL MOSFETS

MP2233 Rev. 1.01

www.MonolithicPower.com

12/6/2012

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

MP2233DJ

TSOT-23-8

AEU

For Tape & Reel, add suffix –Z (e.g. MP2233DJ–Z);

For RoHS, compliant packaging, add suffix –LF (e.g. MP2233DJ–LF–Z).

PACKAGE REFERENCE

TOP VIEW

VCC

EN/SYNC

BST

GND

ABSOLUTE MAXIMUM RATINGS (1)

VIN ..................................................-0.3V to 17V

VSW...-0.3V (-5V for <10ns) to 17V (19V for 5ns)

VBST ........................................................ VSW+6V

All Other Pins................................ -0.3V to 6V

(2)

Continuous Power Dissipation (TA = +25°C)

(3)

........................................................... 1.25W

Junction Temperature...............................150°C

Lead Temperature ....................................260°C

Storage Temperature................. -65°C to 150°C

Recommended Operating Conditions

(4)

Supply Voltage VIN ...........................4.5V to 16V

Output Voltage VOUT.................... 0.8V to VIN–3V

Operating Junction Temp. (TJ). -40°C to +125°C

Thermal Resistance

(5)

θJA

θJC

TSOT-23-8............................. 100 ..... 55... °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) About the details of the EN pin’s ABS MAX rating, please

refer to Page 9, Enable section.

3) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX)-TA)/θJA. Exceeding the maximum allowable power

dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

4) The device is not guaranteed to function outside of its

operating conditions.

5) Measured on JESD51-7, 4-layer PCB.

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