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MP2013 Arkusz danych(PDF) 2 Page - Monolithic Power Systems |
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MP2013 Arkusz danych(HTML) 2 Page - Monolithic Power Systems |
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2 / 15 page ![]() MP2013 - 40V, 150mA, LOW QUIESCENT CURRENT LINEAR REGULATOR ORDERING INFORMATION Part Number* Package Top Marking MP2013GJ TSOT23-5 AFF MP2013GG QFN6 (2x2mm) AX MP2013GQ QFN8 (3x3mm) AFF MP2013GQ-33 QFN8 (3x3mm) AGG * For Tape & Reel, add suffix –Z (e.g. MP2013GJ–Z); PACKAGE REFERENCE TSOT23-5 QFN6(2x2mm) QFN8(3x3mm) ABSOLUTE MAXIMUM RATINGS (1) IN1, IN2 ..................................... -0.3V to +42V OUT............................................. -0.3V to +17V FB ................................................ -0.3V to +6V Lead Temperature ................................... 260 °C Storage Temperature............... -65 °C to +150°C Continuous Power Dissipation (TA = +25°C) (2) QFN8(3x3mm) .........................................2.08W QFN6(2x2mm) .........................................1.25W TSOT23-5................................................0.45W ESD SUSCEPTIBILITY (3) HBM (Human Body Mode) ..........................2kV MM (Machine Mode) ................................ 200V Recommended Operating Conditions (4) Supply Voltage VIN .......................... 2.5V to 40V Output Voltage VOUT ................... 1.215V to 15V Operating Junction Temp. (TJ). -40°C to +125°C Thermal Resistance (5) θJA θJC TSOT23-5 ............................. 220 .... 110.. °C/W QFN6(2x2mm) ....................... 80 ...... 16... °C/W QFN8(3x3mm) ....................... 48 ...... 11... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient th ermal resistance θ JA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA )/θ JA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Devices are ESD sensitive. Handling precaution recommended. 4) The device is not guaranteed to function outside of its operating conditions. 5) Measured on JESD51-7, 4-layer PCB. MP2013 Rev. 1.0 www.MonolithicPower.com 2 4/23/2014 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2014 MPS. All Rights Reserved. |
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