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MP3373GY Arkusz danych(PDF) 3 Page - Monolithic Power Systems |
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MP3373GY Arkusz danych(HTML) 3 Page - Monolithic Power Systems |
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3 / 20 page ![]() MP3373, 8 STRINGS, WLED CONTROLLER WITH EXTERNAL TRANSISTOR MP3373 Rev. 1.02 www.MonolithicPower.com 3 8/16/2016 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2016 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking MP3373GY* SOIC-28 MP3373 MP3373GM* TSSOP-28 MP3373 * For phase shift function, please only order MP3373GY-C755 or MP3373GM-C755 PACKAGE REFERENCE Package Diagram Package Diagram TSSOP-28 SOIC-28 ABSOLUTE MAXIMUM RATINGS (1) VIN ...................................................-0.3V to 42V VGATE ,VCC , VFAULT...........................-0.3V to 11V VCTL1 to VCTL8...................................-0.3V to 55V All Other Pins...............................-0.3V to +6.3V Continuous Power Dissipation (TA = +25°C) (2) TSSOP-28………………………………...1.56 W SOIC-28……………………………………2.08W Junction Temperature...............................150 C Lead Temperature ....................................260 C Storage Temperature............... -65 C to +150C Recommended Operating Conditions (3) Supply Voltage VIN ..............................9V to 40V Operating Junction Temp ........ -40°C to +125°C Thermal Resistance (4) θJA θJC TSSOP-28...................... ........ 80 ...... 30... C/W SOIC-28....…......…........ ........ 60 ...... 30... C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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