ADL5611

Data Sheet

Rev. B | Page 14 of 16

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

Figure 29 shows the recommended land pattern for the ADL5611.

To minimize thermal impedance, the exposed pad on the

underside of the SOT-89 package is soldered to a ground plane,

along with Pin 2. If multiple ground layers exist, stitch the layers

together using vias.

Figure 29. Recommended Land Pattern

The land pattern on the ADL5611 evaluation board provides a

the temperature at the top of the SOT-89 package is sensed with

an IR temperature gun.

Thermal simulation suggests a junction temperature that is

10°C higher than the top of package temperature. With additional

measurements of the ambient temperature and input/output

W-CDMA ACPR PERFORMANCE

Figure 30 shows a plot of the adjacent channel power ratio

single wideband code division multiple access (W-CDMA)

carrier (Test Model 1-64) at 2140 MHz. This signal is generated

by a very low ACPR source. ACPR is measured at the output by

a high dynamic range spectrum analyzer that incorporates an

instrument noise correction function.

at 2140 MHz

The ADL5611 achieves an ACPR of −79 dBc at an output power

level of −5 dBm, at which point the device noise and not distortion

begins to dominate the power in the adjacent channels. At an

output power level of 5 dBm, ACPR is still very low at −62 dBc.

3.00mm

3.48mm

1.80mm

5.37mm

0.20mm

0.762mm

0.635mm

0.62mm

0.86mm

0.86mm

1.50mm

1.27mm

0

–90

–80

–70

–60

–50

–40

–30

–20

–10

–20

–15

–10

–5

0

10

5