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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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LP-T67F Arkusz danych(PDF) 12 Page - OSRAM GmbH |
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LP-T67F Arkusz danych(HTML) 12 Page - OSRAM GmbH |
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12 / 20 page  2012-03-12 12 Version 1.0 LP T67F Recommended Solder Pad 9) page 19 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 19 Reflow-Löten Recommended Solder Pad 9) page 19 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 19 Reflow-Löten OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 2.3 (0.091) 3.3 (0.130) Cu Fläche / 16 mm per pad 2 Cu-area _ < 3.3 (0.130) Kathode/ Cathode Anode 0.7 (0.028) Fläche darf bei Verwendung von TOPLED ® For TOPLED ® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact Fläche darf bei Verwendung von TOPLED ® For TOPLED ® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact |
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