LTM8049 datasheet(2/20 Pages) LINER

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LTM4661

4661f

For more information www.linear.com/LTM4661

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

VIN .............................................................. –0.3V to 6V

VOUT........................................................... –0.3V to 18V

COMP, FREQ ........................................ –0.3V to INTVCC

SYNC/MODE, SDB ....................................... –0.3V to 6V

Operating Internal Temperature Range

(Note 2) ............................................. –40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow Body Temperature ................. 250°C

(Note 1)

SDB

GND

COMP

INTVCC

FREQ

SYNC/MODE

GND

VIN

BGA PACKAGE

25-Lead (6.25mm × 6.25mm × 2.42mm)

BGA PACKAGE

25-Lead (6.25mm × 6.25mm × 2.42mm)

TOP VIEW

VOUT

TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W,

θJB + θBA = 22°C/W, θJA = 22°C/W

WEIGHT = 0.25g

ORDER INFORMATION

(See Pin Functions, Pin Configuration Table)

http://www.linear.com/product/LTM4661#orderinfo

PART NUMBER

PAD OR BALL FINISH

PART MARKING*

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(Note 2)

DEVICE

FINISH CODE

LTM4661EY#PBF

SAC305 (RoHS)

LTM4661Y

BGA

–40°C to 125°C

LTM4661IY#PBF

SAC305 (RoHS)

LTM4661Y

BGA

–40°C to 125°C

LTM4661IY

SnPb (63/37)

LTM4661Y

BGA

–40°C to 125°C

• Consult Marketing for parts specified with wider operating temperature

ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Terminal Finish Part Marking: www.linear.com/leadfree

• Recommended BGA PCB Assembly and Manufacturing Procedures:

www.linear.com/umodule/pcbassembly

• BGA Package and Tray Drawings: www.linear.com/packaging

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