 |
Zakładka z wyszukiwarką danych komponentów |
|
|
Zakładka z wyszukiwarką danych komponentów |
|
LS-T67D Arkusz danych(PDF) 11 Page - OSRAM GmbH |
|
|
|||||||||||||||||||||||||||||
LS-T67D Arkusz danych(HTML) 11 Page - OSRAM GmbH |
|
|
11 / 19 page  Version 1.1 LS T67D 2012-03-12 11 Recommended Solder Pad 9) page 18 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 18 Reflow Löten Recommended Solder Pad 9) page 18 Reflow soldering Empfohlenes Lötpaddesign 9) Seite 18 Reflow Löten OHLPY970 2.6 (0.102) Cu-area > 16 mm Cu-Fläche > 16 mm 2 2 Solder resist Lötstopplack 2.6 (0.102) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for OHLPY440 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 2.3 (0.091) 3.3 (0.130) Cu Fläche / 16 mm per pad 2 Cu-area _ < 3.3 (0.130) Kathode/ Cathode Anode 0.7 (0.028) Fläche darf bei Verwendung von TOPLED ® For TOPLED ® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact Fläche darf bei Verwendung von TOPLED ® For TOPLED ® assembly do not use elektrisch nicht beschaltet werden. this area for electrical contact |
|
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Polish ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
