Zakładka z wyszukiwarką danych komponentów
  Polish  ▼
ALLDATASHEET.PL

X  

AD8336ACPZ-R7 Arkusz danych(PDF) 6 Page - Analog Devices

Numer części AD8336ACPZ-R7
Szczegółowy opis  General-Purpose Wide Bandwidth, DC-Coupled VGA
PDF  27 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
Logo AD - Analog Devices

AD8336ACPZ-R7 Arkusz danych(HTML) 6 Page - Analog Devices

Back Button AD8336ACPZ-R7 Datasheet HTML 2Page - Analog Devices AD8336ACPZ-R7 Datasheet HTML 3Page - Analog Devices AD8336ACPZ-R7 Datasheet HTML 4Page - Analog Devices AD8336ACPZ-R7 Datasheet HTML 5Page - Analog Devices AD8336ACPZ-R7 Datasheet HTML 6Page - Analog Devices AD8336ACPZ-R7 Datasheet HTML 7Page - Analog Devices AD8336ACPZ-R7 Datasheet HTML 8Page - Analog Devices AD8336ACPZ-R7 Datasheet HTML 9Page - Analog Devices AD8336ACPZ-R7 Datasheet HTML 10Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 6 / 27 page
background image
AD8336
Data Sheet
Rev. F | Page 6 of 27
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NOTES
1. NC = NO CONNECT.
2. THE EXPOSED PAD IS NOT CONNECTED INTERNALLY.
FOR INCREASED RELIABILITY OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS
RECOMMENDED THAT THE PADDLE BE SOLDERED
TO THE GROUND PLANE.
VOUT
PWRA
VCOM
INPP
GNEG
GPOS
VNEG
VGAI
1
2
3
4
11
12
10
9
AD8336
TOP VIEW
(Not to Scale)
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
VOUT
Output Voltage.
2
PWRA
Power Control. Normal power when grounded; power reduced by half if PWRA is pulled high.
3
VCOM
Common-Mode Voltage. Normally GND when using a dual supply.
4
INPP
Positive Input to Preamplifier.
5
INPN
Negative Input to Preamplifier.
6
NC
No Connect.
7
NC
No Connect.
8
PRAO
Preamplifier Output.
9
VGAI
VGA Input.
10
VNEG
Negative Supply.
11
GPOS
Positive Gain Control Input.
12
GNEG
Negative Gain Control Input.
13
VPOS
Positive Supply.
14
NC
No Connect.
15
NC
No Connect.
16
NC
No Connect.
Not applicable
EPAD
The Exposed Pad is Not Connected Internally. For increased reliability of the solder joints and maximum
thermal capability, it is recommended that the paddle be soldered to the ground plane.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27


Arkusz danych Pobierz

Go To PDF Page


Link URL



Czy Alldatasheet okazała się pomocna?  [ DONATE ] 

O Alldatasheet   |   Reklama   |   Kontakt   |   Polityka prywatności   |   Link do karty katalogowej    |   Linki   |   Lista producentów
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com