Data Sheet

ADL5331

Rev. A | Page 15 of 15

OUTLINE DIMENSIONS

0.80

0.75

0.70

0.50

BSC

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-8

BOTTOM VIEW

TOP VIEW

4.10

4.00 SQ

3.90

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

PIN 1

INDICATOR

1

24

7

12

13

18

19

6

0.30

0.25

0.20

0.20 MIN

2.44

2.30 SQ

2.16

EXPOSED

PAD

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 26. 24-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-24-14)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package

Option

Ordering

Quantity

ADL5331ACPZ-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP]

CP-24-14

1,500

ADL5331-EVALZ

ADL5331 Evaluation Board

1

Z = RoHS Compliant Part.

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registered trademarks are the property of their respective owners.

D07593-0-10/17(A)