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MP8770 Arkusz danych(PDF) 3 Page - Monolithic Power Systems

Numer części MP8770
Szczegółowy opis  17V, 8A, 700kHz, High-Efficiency, Synchronous, Step-Down
PDF  23 Pages
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Producent  MPS [Monolithic Power Systems]
Strona internetowa  http://www.monolithicpower.com
Logo MPS - Monolithic Power Systems

MP8770 Arkusz danych(HTML) 3 Page - Monolithic Power Systems

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MP8770
– 17V, 8A, SYNCHRONOUS, STEP-DOWN CONVERTER
MP8770 Rev. 1.0
www.MonolithicPower.com
3
1/4/2018
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2018 MPS. All Rights Reserved.
ABSOLUTE MAXIMUM RATINGS (1)
VIN .................................................-0.3V to +20V
VSW........................................ -0.3V (-5V < 10ns)
to VIN + 0.7V (23V < 10ns)
VBST ...................................................... VSW + 4V
VEN ................................................................. VIN
All other pins ...................................-0.3V to +4V
Continuous power dissipation (TA = +25°C)
(2)
................................................................... 3.2W
Junction temperature ................................150°C
Lead temperature .....................................260°C
Storage temperature .................. -65°C to 125°C
Recommended Operating Conditions
(3)
Supply voltage (VIN) .........................4.5V to 17V
Output voltage (VOUT) ..............0.6V to VIN * DMAX
or 12V max
Operating junction temp. (TJ) ... -40°C to +125°C
Thermal Resistance
θJA
θJC
QFN-16 (3mmx3mm)
EV8770-Q-00A ...................... 38....... 10 ... °C/W
JESD51-7
(4).......................... 50....... 12... °C/W
NOTES:
Exceeding these ratings may damage the device.
The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θ
JA, and the ambient temperature
TA. The maximum allowable continuous power dissipation on
EV8770-Q-00A board at any ambient temperature is calculated
by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum
allowable power dissipation produces an excessive die
temperature, causing the regulator to go into thermal
shutdown. Internal thermal shutdown circuitry protects the
device from permanent damage.
The device is not guaranteed to function outside of its operating
conditions.
Measured on JESD51-7, 4-layer PCB.



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