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CDCM1802RGTT Arkusz danych(PDF) 13 Page - Texas Instruments |
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CDCM1802RGTT Arkusz danych(HTML) 13 Page - Texas Instruments |
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13 / 22 page ![]() CDCM1802 CLOCK BUFFER WITH PROGRAMMABLE DIVIDER, LVPECL I/O + ADDITIONAL LVCMOS OUTPUT SCAS759 − APRIL 2004 13 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PARAMETER MEASUREMENT INFORMATION Package Thermal Pad (Underside) Top Side Island Thermal Via Dia 0.020 In. Heat Dissipation VSS Copper Plane VSS Copper Plane Figure 12. Recommended Thermal Via Placement See the SCBA017 and the SLUA271 application notes for further package related information. |
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