© 2005 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FSA2467 Rev. 1.0.8

9

Package Dimensions

Figure 15.

16-Lead, Molded Leadless Package (MLP), JEDEC MO-220 3x3mm Square

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner

without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or

obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,

specifically the warranty therein, which covers Fairchild products.

Always visit Fairchild

Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/packaging/.

For current tape and reel specifications,

visit Fairchild Semiconductor’s online packaging area:

http://www.fairchildsemi.com/packaging/3x3MLP16_Pack_TNR.pdf.