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LM358ADE4 Arkusz danych(PDF) 32 Page - Texas Instruments

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Numer części LM358ADE4
Szczegółowy opis  Industry-Standard Dual Operational Amplifiers
PDF  47 Pages
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

LM358ADE4 Arkusz danych(HTML) 32 Page - Texas Instruments

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Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM358DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM358DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM358PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM358PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM358PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM358PWRG3
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM358PWRG4
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM358PWRG4-JF
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM258ADGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM258ADGKR
VSSOP
DGK
8
2500
332.0
358.0
35.0
LM258ADR
SOIC
D
8
2500
364.0
364.0
27.0
LM258ADR
SOIC
D
8
2500
367.0
367.0
35.0
LM258ADR
SOIC
D
8
2500
340.5
338.1
20.6
LM258ADR
SOIC
D
8
2500
333.2
345.9
28.6
LM258ADRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM258ADRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM258DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Dec-2017
Pack Materials-Page 3



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