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MPC941 Arkusz danych(PDF) 7 Page - Integrated Device Technology |
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MPC941 Arkusz danych(HTML) 7 Page - Integrated Device Technology |
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7 / 13 page ![]() REVISION 10 3/18/15 7 LOW VOLTAGE, 1:27 CLOCK DISTRIBUTION CHIP MPC941 DATA SHEET Power Consumption of the MPC941 and Thermal Management The MPC941 AC specification is guaranteed for the entire operating frequency range up to 250 MHz. The MPC941 power consumption and the associated long-term reliability may decrease the maximum frequency limit, depending on operating conditions such as clock frequency, supply voltage, output loading, ambient temperture, vertical convection and thermal conductivity of package and board. This section describes the impact of these parameters on the junction temperature and gives a guideline to estimate the MPC941 die junction temperature and the associated device reliability. For a complete analysis of power consumption as a function of operating conditions and associated long term device reliability, please refer to the Freescale application note AN1545. According the AN1545, the long-term device reliability is a function of the die junction temperature: Increased power consumption will increase the die junction temperature and impact the device reliability (MTBF). According to the system-defined tolerable MTBF, the die junction temperature of the MPC941 needs to be controlled, and the thermal impedance of the board/package should be optimized. The power dissipated in the MPC941 is represented in equation 1. Where ICCQ is the static current consumption of the MPC941, CPD is the power dissipation capacitance per output. C L represents the external capacitive output load, and N is the number of active outputs (N is always 27 in case of the MPC941). The MPC941 supports driving transmission lines to maintain high signal integrity and tight timing parameters. Any transmission line will hide the lumped capacitive load at the end of the board trace, therefore, C L is zero for controlled transmission line systems and can be eliminated from equation 1. Using parallel termination output termination results in equation 2 for power dissipation. In equation 2, P stands for the number of outputs with a parallel or thevenin termination. VOL, IOL, VOH and IOH are a function of the output termination technique, and DCQ is the clock signal duty cyle. If transmission lines are used, C L is zero in equation 2 and can be eliminated. In general, the use of controlled transmission line techniques eliminates the impact of the lumped capacitive loads at the end lines and greatly reduces the power dissipation of the device. Equation 3 describes the die junction temperature TJ as a function of the power consumption. Where Rthja is the thermal impedance of the package (junction to ambient), and TA is the ambient temperature, according to Table 7, the junction temperature can be used to estimate the long-term device reliability. Further, combining equation 1 and equation 2 results in a maximum operating frequency for the MPC941 in a series terminated transmission line system. TJ,MAX should be selected according to the MTBF system requirements, and Table 7, Rthja can be derived from Table 8. The Rthja represent data based on 1S2P boards. Using 2S2P boards will result in a lower thermal impedance than indicated below. If the calculated maximum frequency is below 250 MHz, it becomes the upper clock speed limit for the given application conditions. The following eight derating charts describe the safe frequency operation range for the MPC941. The charts were calculated for a maximum tolerable die junction temperature of 110 C (120C), corresponding to a estimated MTBF of 9.1 years (4 years), a supply voltage of either 3.3 V or 2.5 V, and series terminated transmission line or capacitive loading. Depending on a given set of these operating conditions and the available device convection, a decision on the maximum operating frequency can be made. Table 7. Die Junction Temperature and MTBF Junction Temperature (C) MTBF (Years) 100 20.4 110 9.1 120 4.2 130 2.0 Table 8. Thermal Package Impedance of the 48ld LQFP Convection, LFPM Rthja (1P2S board), K/W Still air 78 100 lfpm 68 200 lfpm 59 300 lfpm 56 400 lfpm 54 500 lfpm 53 PTOT = [ ICCQ + VCC · fCLOCK · ( N · CPD + CL ) ] · VCC M PTOT = VCC · [ ICCQ + VCC · fCLOCK · ( N · CPD + CL ) ] + [ DCQ · IOH · (VCC – VOH) + (1 – DCQ) · IOL · VOL ] M P TJ = TA + PTOT · Rthja fCLOCK,MAX = CPD · N · V 2 CC 1 · [ – (ICCQ · VCC) ] Rthja Tj,MAX – TA Equation 1 Equation 2 Equation 3 Equation 4 |
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