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ZXLD1371QESTTC Arkusz danych(PDF) 39 Page - Diodes Incorporated

Numer części ZXLD1371QESTTC
Szczegółowy opis  AUTOMOTIVE GRADE 60V HIGH ACCURACY BUCK
PDF  42 Pages
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Producent  DIODES [Diodes Incorporated]
Strona internetowa  http://www.diodes.com
Logo DIODES - Diodes Incorporated

ZXLD1371QESTTC Arkusz danych(HTML) 39 Page - Diodes Incorporated

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ZXLD1371Q
ZXLD1371Q
Document number: DS37116 Rev. 1 - 2
39 of 42
www.diodes.com
September 2015
© Diodes Incorporated
ZXLD1371Q
Application Information (cont.)
PCB Layout Considerations
PCB layout is a fundamental to device performance in all configurations. Figure 20 shows a section of a proven ZXLD1371Q PCB layout.
Figure 20. Circuit Layout
Here are some considerations useful for the PCB layout using ZXLD1371Q in Buck, Boost and Buck-Boost configurations:
In order to avoid ringing due to stray inductances, the inductor L1, the anode of D1 and the drain of Q1 should be placed as close
together as possible.
The shaping capacitor C1 is fundamental for the stability of the control loop. To this end it should be placed no more than 5mm
from the SHP pin.
Input voltage pins, VIN and VAUX, need to be decoupled. It is recommended to use two ceramic capacitors of 2.2uF, X7R, 100V
(C3 and C4). In addition to these capacitors, it is suggested to add two ceramic capacitors of 1uF, X7R, 100V each (C2, C8), as
well as a further decoupling capacitor of 100nF close to the VIN/VAUX pins (C9). VIN and VAUX pins can be short-circuited
when the device is used in buck mode, or can be driven from a separate supply.
The underside of the PCB should be a solid copper ground plane, electrically bonded to top ground copper at regular intervals
using plated-through via holes. The ground plane should be unbroken as far as possible, particularly in the area of the switching
circuit including the ZXLD1371Q, L1, Q1 D, C3 and C4. Plated via holes are necessary to provide a short electrical path to
minimize stray inductance.
Critical positions of via holes include the decoupling capacitors, the source connection of the
MOSFET and the ground connections of the ZXLD1371Q, including the center paddle. These via holes also serve to conduct
heat away from the semiconductors and minimize the device junction temperatures.
Evaluation Boards
To support easier evaluation of the ZXLD1371Q three evaluation boards have been developed which available via your Diodes sales
representative for qualified opportunities:
ZXLD1371EV4
Buck Configuration
ZXLD1371EV5
Buck-Boost Configuration
ZXLD1371EV6
Boost Configuration
SHP pin
VIN / VAUX
decoupling
Inductor, Switch
and
Freewheeling
diode



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