16T08AFSW datasheet(6/7 Pages) NELLSEMI

6 / 7 page

SEMICONDUCTOR

16T Series RoHS

RoHS

Rth(j-a)(°C/W)

Fig.11 D²PAK thermal resistance junction to ambient versus

copper surface under tab (printed circuit FR4, copper

thickness: 35µm

Case Style

2.87 (0.113)

2.62 (0.103)

9.40 (0.370)

9.14 (0.360)

10.54 (0.415) MAX.

16.13 (0.635)

15.87 (0.625)

4.06 (0.160)

3.56 (0.140)

1.45 (0.057)

1.14 (0.045)

2.67 (0.105)

2.41 (0.095)

2.65 (0.104)

2.45 (0.096)

5.20 (0.205)

4.95 (0.195)

0.90 (0.035)

0.70 (0.028)

3.91 (0.154)

3.74 (0.148)

4.70 (0.185)

4.44 0.1754

(

)

1.39 (0.055)

1.14 (0.045)

3.68 (0.145)

3.43 (0.135)

8.89 (0.350)

8.38 (0.330)

29.16 (1.148)

28.40 (1.118)

14.22 (0.560)

13.46 (0.530)

0.56 (0.022)

0.36 (0.014)

2.79 (0.110)

2.54 (0.100)

15.32 (0.603)

14.55 (0.573)

TO-220AB

TO-263(D PAK)

2.79 (0.110)

0.36 (0.014)

2.79 (0.110)

2.29 (0.090)

1.40 (0.055)

1.19 (0.047)

0 to 0.254 (0 to 0.01)

1.40 (0.055)

1.14 (0.045)

4.83 (0.190)

4.06 (0.160)

10.45 (0.411)

9.65 (0.380)

6.22 (0.245)

9.14 (0.360)

8.13 (0.320)

15.00 (0.591)

0.940 (0.037)

0.686 (0.027)

2.67 (0.105)

2.41 (0.095)

5.20 (0.205)

4.95 (0.195)

15.85 (0.624)

3.56 (0.140)

0.53 (0.021)

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Page 6 of 7

S(cm²)

D²PAK

2(A2)

3(G)

1(A1)

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