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BQ27Z561-R1 Arkusz danych(PDF) 21 Page - Texas Instruments |
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BQ27Z561-R1 Arkusz danych(HTML) 21 Page - Texas Instruments |
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21 / 24 page ![]() www.ti.com PACKAGE OUTLINE C 0.4 MAX 0.175 0.125 1.5 TYP 0.5 TYP 12X 0.25 0.15 0.5 TYP 1 TYP B E A D 4222640/A 12/2015 DSBGA - 0.4 mm max height YPH0012 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. NanoFree TM package configuration. NanoFree Is a trademark of Texas Instruments. BALL A1 INDEX AREA SEATING PLANE BALL TYP 0.05 C A 1 3 0.015 C A B SYMM SYMM C 2 B D SCALE 7.000 |
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