¡ Semiconductor

MSM7578H/7578V/7579

15/18

RECOMMENDATIONS FOR ACTUAL DESIGN

• To assure proper electrical characteristics, use bypass capacitors with excellent high frequency

characteristics for the power supply and keep them as close as possible to the device pins.

• Connect the AG pin and the DG pin each other as close as possible. Connect to the system

ground with low impedance.

• Mount the device directly on the board when mounted on PCBs. Do not use IC sockets. If an

IC socket is unavoidable, use the short lead type socket.

• When mounted on a frame, use electro-magnetic shielding, if any electro-magnetic wave

source such as power supply transformers surround the device.

up phenomenon when turning the power on.

• Use a low noise (particularly, low level type of high frequency spike noise or pulse noise)

power supply to avoid erroneous operation and the degradation of the characteristics of these

devices.