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PDTC323TK Arkusz danych(PDF) 3 Page - NXP Semiconductors |
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PDTC323TK Arkusz danych(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 9397 750 14946 © Koninklijke Philips Electronics N.V. 2005. All rights reserved. Product data sheet Rev. 01 — 3 June 2005 3 of 8 Philips Semiconductors PDTC323TK NPN 500 mA resistor-equipped transistor; R1 = 2.2 k Ω, R2 = open 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 6: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-a) thermal resistance from junction to ambient in free air [1] - - 500 K/W Table 7: Characteristics Tamb =25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB =30V; IE = 0 A - - 100 nA ICEO collector-emitter cut-off current VCE =15V; IB =0A - - 0.5 µA IEBO emitter-base cut-off current VEB =5V; IC = 0 A - - 100 nA hFE DC current gain VCE =5V; IC = 50 mA 100 300 - VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 2.5 mA - 25 80 V R1 bias resistor 1 (input) 1.54 2.2 2.86 k Ω Cc collector capacitance VCB =10V; IE =ie =0A; f = 1 MHz -7 - pF |
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