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MCP1726 Arkusz danych(PDF) 22 Page - Microchip Technology |
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MCP1726 Arkusz danych(HTML) 22 Page - Microchip Technology |
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22 / 30 page ![]() MCP1726 DS21936B-page 22 © 2005 Microchip Technology Inc. 8-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated Exposed Pad Length Exposed Pad Width Contact Length *Controlling Parameter Contact Width Drawing No. C04-062 Notes: Exposed pad dimensions vary with paddle size. Overall Width D2 E2 L b D .016 .008 .009 .085 .055 .012 .118 BSC Number of Pins Standoff Contact Thickness Overall Length Overall Height Pitch p n Units A A1 E A3 Dimension Limits 8 .000 .001 .008 REF. .118 BSC .031 .026 BSC MIN INCHES NOM 0.40 0.30 3.00 BSC 0.20 .020 .096 .015 .069 0.23 2.15 1.40 0.50 0.37 2.45 1.75 0.02 0.80 3.00 BSC 0.20 REF. 0.65 BSC MILLIMETERS* .002 .039 0.00 MIN MAX NOM 8 0.05 1.00 MAX 3. Package may have one or more exposed tie bars at ends. 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. 0.90 .035 (Note 3) (Note 3) 4. JEDEC equivalent: MO-229 Revised 03/11/05 - -- - D2 E A1 A A3 TOP VIEW EXPOSED METAL PAD BOTTOM VIEW 21 ID INDEX PIN 1 D L E2 p b n AREA (NOTE 2) TIE BAR (NOTE 1) EXPOSED ALTERNATE EXPOSED PAD CONFIGURATIONS |
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