Zakładka z wyszukiwarką danych komponentów
  Polish  ▼
ALLDATASHEET.PL

X  

Preview PDF HTML

MT7697DIN Arkusz danych(PDF) 72 Page - List of Unclassifed Manufacturers

Numer części MT7697DIN
Szczegółowy opis  Internet-of-Things Wireless Connectivity
PDF  84 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Producent  ETC2 [List of Unclassifed Manufacturers]
Strona internetowa  
Logo ETC2 - List of Unclassifed Manufacturers

MT7697DIN Arkusz danych(HTML) 72 Page - List of Unclassifed Manufacturers

Back Button MT7697DIN Datasheet HTML 68Page - List of Unclassifed Manufacturers MT7697DIN Datasheet HTML 69Page - List of Unclassifed Manufacturers MT7697DIN Datasheet HTML 70Page - List of Unclassifed Manufacturers MT7697DIN Datasheet HTML 71Page - List of Unclassifed Manufacturers MT7697DIN Datasheet HTML 72Page - List of Unclassifed Manufacturers MT7697DIN Datasheet HTML 73Page - List of Unclassifed Manufacturers MT7697DIN Datasheet HTML 74Page - List of Unclassifed Manufacturers MT7697DIN Datasheet HTML 75Page - List of Unclassifed Manufacturers MT7697DIN Datasheet HTML 76Page - List of Unclassifed Manufacturers Next Button
Zoom Inzoom in Zoom Outzoom out
 72 / 84 page
background image
MT7697D
Internet-of-Things Wireless Connectivity
© 2016 MediaTek Inc.
Page 72 of 84
This document contains information that is proprietary to MediaTek Inc. (“MediaTek”) and/or its licensor(s).
Any unauthorized use, reproduction or disclosure of this document in whole or in part is strictly prohibited.
4.7
Thermal Characteristics
ΘJC assumes that all the heat is dissipated through the top of the package, while ΨJt assumes that the
heat is dissipated through the top, sides, and the bottom of the package. Thus it is suggested to use
ΨJt to estimate the junction temperature.
Table 4-7. Thermal Characteristics
Symbol Description
Performance
Typical
Unit
TJ
Maximum Junction Temperature (Plastic Package)
125
°C
ΘJA
Junction to ambient temperature thermal resistance[1]
19.21
°C/W
ΘJC
Junction to case temperature thermal resistance
7.33
°C/W
ΨJt
Junction to the package thermal resistance[2]
1.65
°C/W
Note 1: JEDEC 51-7 system FR4 PCB size: 76.2mm x 114.3mm
Note 2: 8mm x 8mm QFN-68 package



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84


Arkusz danych Pobierz

Go To PDF Page


Link URL



Czy Alldatasheet okazała się pomocna?  [ DONATE ] 

O Alldatasheet   |   Reklama   |   Kontakt   |   Polityka prywatności   |   Link do karty katalogowej    |   Linki   |   Lista producentów
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com