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GD25WD80CSFG Arkusz danych(PDF) 44 Page - GigaDevice Semiconductor (Beijing) Inc. |
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GD25WD80CSFG Arkusz danych(HTML) 44 Page - GigaDevice Semiconductor (Beijing) Inc. |
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44 / 47 page ![]() Uniform Sector Standard and Dual Serial Flash GD25WD80C 44 10.5. Package USON8 (1.5*1.5mm) Dimensions Symbol A A1 A2 A3 b D E D1 E1 D2 E2 e L L1 K K1 K2 Unit mm Min 0.40 0.00 0.33 REF 0.127 REF 0.13 1.40 1.40 0.20 REF 0.05 REF 0.60 1.20 0.40 REF 0.15 0.06 REF 0.20 REF 0.10 REF 0.15 REF Nom 0.45 0.02 0.18 1.50 1.50 0.70 1.30 0.20 Max 0.50 0.05 0.25 1.60 1.60 0.80 1.40 0.25 Note: 1. Both the package length and width do not include the mold flash. 2. The exposed metal pad area on the bottom of the package is floating. 3. Coplanarity ≤0.08mm. Package edge tolerance≤0.10mm. 4. The lead shape may be of little difference according to different package factories. These lead shapes are compatible with each other. D E Top View D1 E2 L1 e Bottom View A1 Side View 1 4 8 5 K1 PIN 1# A3 A K E1 L b K2 D2 A2 |
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