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WR20, WR25

( Automotive )_V02

Jan.2011

CATALOGUE NUMBERS

The resistors have a catalogue number starting with .

WR25

X

472_

J

T

L

J

Size code

WR25 : 2512

WR20 : 2010

Type code

X :

±5%, 1R ~ 10MR

±1%, 10R ~ 1MR

W :

±1%,< 10R; > 1MR

Resistance code

5%, E24: 2 significant digits

followed by no. of zeros

100

Ω

= 101_

10K

Ω = 103

1%, E24+E96: 3 significant

digits followed by no. of

zeros

100

Ω

=1000

37.4K

Ω

=3742

Tolerance

F :

±1%

J :

±5%

P : Jumper

Packaging code

T

: 7” Reeled taping

Q

: 10” Reeled taping

G

: 13” Reeled taping

B

: Bulk

Termination

code

L = Sn base

(lead free)

Special code

J = Automotive grade

and Anti-Sulfuration

10ppm x 240hrs

TEST AND REQUIREMENTS

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category

LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp

heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical

robustness testing procedure for electronic components" and under standard atmospheric conditions according

to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

REQUIREMENT

TEST

PROCEDURE / TEST METHOD

Resistor

0

Ω

Ω

Ω

Ω

Electrical Characteristics

JISC5201-1: 1998

Clause 4.8

Natural resistance change per change in degree centigrade.

(

)

6

1

2

1

1

2

10

×

−

−

t

t

R

R

R

(ppm/

Within the specified tolerance

Refer to “QUICK REFERENCE

DATA”

<50m

Ω

Resistance to soldering

heat(R.S.H)

MIL-STD-202

method 210

Un-mounted chips completely immersed for 10±1second in a

SAC solder bath at 270℃±5ºC

ΔR/R max.

±(1.0%+0.05Ω)

no visible damage

<50m

Ω

Solderability

J-STD-002

a) Bake the sample for 155℃ dwell time 4hrs/ solder dipping

235℃/ 5sec.

b) Steam the sample dwell time 1 hour/ solder dipping

260℃/ 7sec.

95% coverage min., good tinning and no

visible damage

Temperature cycling

JESD22

Method JA-104

1000 cycles, -55℃ ~ +155℃, dwell time 5~10min

∆R/R max. ±(1.0%+0.05Ω)

No visible damage

<50m

Ω