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PESD3USB30 Arkusz danych(PDF) 13 Page - Nexperia B.V. All rights reserved |
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PESD3USB30 Arkusz danych(HTML) 13 Page - Nexperia B.V. All rights reserved |
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13 / 19 page ![]() PESDXUSB30_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2016. All rights reserved. Product data sheet Rev. 2 — 26 April 2016 13 of 19 Nexperia PESDxUSB30 series ESD protection for differential data lines Fig 17. Package outline WLCSP15 References Outline version European projection Issue date IEC JEDEC JEITA PESD3USB30 pesd3usb30_po Unit mm max nom min 0.60 0.38 2.42 1.22 0.80 A Dimensions (mm are the original dimensions) WLCSP15: wafer level chip-size package; 15 bumps (6-3-6) PESD3USB30 A1 b 0.31 DE e e1 e2 0.80 e3 0.57 0.37 2.37 1.17 0.40 0.40 0.26 0.54 0.36 2.32 1.12 0.21 0 1 mm scale detail X A A1 D E bump A1 index area bump A1 index area X e2 e e1 e3 b 12 4 36 5 A B C 1/2 e B1 B2 B3 16-01-19 |
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