Page 1 of 4 

www.siliconsupplies.com

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Die Size (Unsawn)

1600 x 1100

63 x 43

µm

mils

Minimum Bond Pad Size

130 x 130

5.12 x 5.12

µm

mils

Die Thickness

350 (±20)

13.78 (±0.79)

µm

mils

Top Metal Composition

Al 1%Si 1.1µm

Back Metal Composition

N/A – Bare Si

Advanced Low Power Schottky Logic – 54ALS08

Quad 2-Input AND Gate in bare die form

High speed – 2ns (Min) propagation delay

Full Military Temperature Range.

Direct drop-in replacement for obsolete

components in long term programs.

Rev 1.0

23/11/19

Features:

Ordering Information

The following part suffixes apply:

No suffix - MIL-STD-883 /2010B Visual Inspection

“H” - MIL-STD-883 /2010B Visual Inspection

+ MIL-PRF-38534 Class H LAT

“K” - MIL-STD-883 /2010A Visual Inspection (Space)

+ MIL-PRF-38534 Class K LAT

LAT = Lot Acceptance Test.

For further information on LAT process flows see below.

www.siliconsupplies.com\quality\bare-die-lot-qualification

Supply Formats:

Mechanical Specification

Default – Die in Waffle Pack (300 per tray capacity)

Sawn Wafer on Tape – On request

Unsawn Wafer – On request

Die Thickness <> 350µm(14 Mils) – On request

Assembled into Ceramic Package – On request

The 54ALS08 quad 2-input AND gate is fabricated using

using a 2µm 40V Bipolar process. The device consists of

four independent 2-input AND gates with standard push-pull

Y = A + B. All inputs are protected against ESD and excess

voltage transients.

 

Description

Die Dimensions in µm (mils)

1600 (63)