MC74AC32, MC74ACT32

http://onsemi.com

5

MARKING DIAGRAMS

PDIP−14

SOIC−14

TSSOP−14

SOEIAJ−14

1

14

74AC32

ALYWG

AC32G

AWLYWW

1

14

AC

32

ALYWG

G

1

14

MC74AC32N

AWLYYWWG

1

14

A

=

Assembly Location

L, WL

=

Wafer Lot

Y, YY

=

Year

W, WW

=

Work Week

G

= Pb−Free Package

G

= Pb−Free Package

(Note: Microdot may be in either location)

1

14

74ACT32

ALYWG

AC32TG

AWLYWW

1

14

ACT

32

ALYWG

G

1

14

MC74ACT32N

AWLYYWWG

1

14

ORDERING INFORMATION

Device

Package

MC74AC32N

PDIP−14

25 Units / Rail

MC74AC32NG

PDIP−14

(Pb−Free)

MC74ACT32N

PDIP−14

MC74ACT32NG

PDIP−14

(Pb−Free)

MC74AC32D

SOIC−14

55 Units / Rail

MC74AC32DG

SOIC−14

(Pb−Free)

MC74AC32DR2

SOIC−14

2500 Units / Reel

MC74AC32DR2G

SOIC−14

(Pb−Free)

MC74ACT32D

SOIC−14

55 Units / Rail

MC74ACT32DG

SOIC−14

(Pb−Free)

MC74ACT32DR2

SOIC−14

2500 Units / Reel

MC74ACT32DR2G

SOIC−14

(Pb−Free)

MC74AC32DTR2

TSSOP−14*

MC74AC32DTR2G

TSSOP−14*

MC74ACT32DTR2

TSSOP−14*

MC74ACT32DTR2G

TSSOP−14*

MC74AC32MEL

SOEIAJ−14

2000 Units / Reel

MC74AC32MELG

SOEIAJ−14

(Pb−Free)

MC74ACT32MEL

SOEIAJ−14

MC74ACT32MELG

SOEIAJ−14

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*This package is inherently Pb−Free.