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AS5047U-HTST Arkusz danych(PDF) 45 Page - ams AG |
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AS5047U-HTST Arkusz danych(HTML) 45 Page - ams AG |
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45 / 51 page ![]() ams Datasheet Page 45 [v1-00] 2018-Oct-30 Document Feedback AS5047U − Mechanical Data Figure 63: TSSOP14 Die Placement and Hall Array Position Note(s): 1. Dimensions are in mm. 2. The Hall array center is located in the center of the IC package. Hall array radius is 1.25mm. 3. Die thickness is 203μm nominal. Mechanical Data Hall radius 2.130±0.235 0.306±0.100 0.694±0.150 0.236±0.100 |
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