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AM386SX Arkusz danych(PDF) 29 Page - Advanced Micro Devices |
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AM386SX Arkusz danych(HTML) 29 Page - Advanced Micro Devices |
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29 / 30 page ![]() FINAL Am386SX/SXL/SXLV Microprocessors Data Sheet 29 PACKAGE THERMAL SPECIFICATIONS The Am386SX/SXL/SXLV processors are specified for operation when TCASE (the case temperature) is within the range of 0 °C to +100°C for commercial parts, and –40°C to +100°C for industrial parts. TCASE can be mea- sured in any environment to determine whether the Am386SX/SXL/SXLV processors are within the speci- fied operating range. The case temperature should be measured at the center of the top surface opposite the pins. The ambient temperature (TA) is guaranteed as long as TCASE is not violated. The ambient temperature can be calculated from θ JC and θJA and from these equations: TJ = TCASE + P • θJC TA = TJ – P • θJA TCASE = TA + P • [θJA – θJC] where: TJ, TA, TCASE = Junction, Ambient, and Case Temperature θ JC, θJA = Junction-to-Case and Junction-to-Ambient Thermal Resistance, respectively P = Maximum Power Consumption In the 100-lead PQFP package, θ JA=45.0 and θJC=11.0. ELECTRICAL SPECIFICATIONS The Am386SX/SXL/SXLV CPU has modest power re- quirements. However, its high clock frequency and 47 output buffers (address, data, control, and HLDA) can cause power surges as multiple output buffers drive new signal levels simultaneously. For clean on-chip power distribution at high frequency, 14 VCC and 18 VSS pins separately feed functional units of the Am386SX/SXL/SXLV CPU. Power and ground connections must be made to all ex- ternal VCC and VSS pins of the Am386SX/SXL/SXLV CPU. On the circuit board, all VCC pins should be con- nected on a VCC plane, and VSS pins should be con- nected on a GND plane. Power Decoupling Recommendations Liberal decoupling capacitors should be placed near the Am386SX/SXL/SXLV CPU. The Am386SX/SXL/ SXLV CPU driving its 24-bit address bus and 16-bit data bus at high frequencies can cause transient power surges, particularly when driving large capacitive loads. Low inductance capacitors and interconnects are recommended for best high frequency electrical performance. Inductance can be reduced by shorten- ing circuit board traces between the Am386SX/SXL/ SXLV CPU and decoupling capacitors as much as pos- sible. Resistor Recommendations The ERROR, FLT, and BUSY inputs have internal pull- up resistors of approximately 20 Kohms, and the PEREQ input has an internal pull-down resistor of ap- proximately 20 Kohms, built into the Am386SX/SXL/ SXLV CPU to keep these signals inactive when a 387SX-compatible math coprocessor is not present in the system (or temporarily removed from its socket). In typical designs, the external pull-up resistors shown in Table 1 are recommended. However, a particular de- sign may have reason to adjust the resistor values rec- ommended here, or alter the use of pull-up resistors in other ways. Other Connection Recommendations For reliable operation, always connect unused inputs to an appropriate signal level. NC pins should always re- main unconnected. Connection of NC pins to VCC or VSS will result in component malfunction or incompati- bility with future steppings of the Am386SX/SXL/SXLV CPU. Particularly when not using the interrupts or bus hold (as when first prototyping), prevent any chance of spu- rious activity by connecting these associated inputs to GND: Pin Signal 40 INTR 38 NMI 4HOLD If not using address pipelining, connect pin 6 (NA) through a pull-up in the range of 20 Kohms to VCC. Table 1. Recommended Resistor Pull-Ups to VCC Pin Signal Pull-Up Value Purpose 16 ADS 20 Kohms ± 10% Lightly pull ADS inactive during Am386SX/SXL/SXLV CPU Hold Acknowledge states. 26 LOCK 20 Kohms ± 10% Lightly pull LOCK inactive during Am386SX/SXL/ SXLV CPU Hold Acknowledge states. |
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