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AM386SX Arkusz danych(PDF) 29 Page - Advanced Micro Devices

Numer części AM386SX
Szczegółowy opis  High-Performance, Low-Power, Embedded Microprocessors
PDF  30 Pages
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Producent  AMD [Advanced Micro Devices]
Strona internetowa  http://www.amd.com
Logo AMD - Advanced Micro Devices

AM386SX Arkusz danych(HTML) 29 Page - Advanced Micro Devices

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FINAL
Am386SX/SXL/SXLV Microprocessors Data Sheet
29
PACKAGE THERMAL SPECIFICATIONS
The Am386SX/SXL/SXLV processors are specified for
operation when TCASE (the case temperature) is within
the range of 0
°C to +100°C for commercial parts, and
–40°C to +100°C for industrial parts. TCASE can be mea-
sured in any environment to determine whether the
Am386SX/SXL/SXLV processors are within the speci-
fied operating range. The case temperature should be
measured at the center of the top surface opposite the
pins.
The ambient temperature (TA) is guaranteed as long as
TCASE is not violated. The ambient temperature can be
calculated from
θ
JC and θJA and from these equations:
TJ = TCASE + P • θJC
TA = TJ – P • θJA
TCASE = TA + P • [θJA – θJC]
where:
TJ, TA, TCASE = Junction, Ambient, and Case Temperature
θ
JC, θJA
= Junction-to-Case and Junction-to-Ambient
Thermal Resistance, respectively
P
= Maximum Power Consumption
In the 100-lead PQFP package,
θ
JA=45.0 and θJC=11.0.
ELECTRICAL SPECIFICATIONS
The Am386SX/SXL/SXLV CPU has modest power re-
quirements. However, its high clock frequency and 47
output buffers (address, data, control, and HLDA) can
cause power surges as multiple output buffers drive
new signal levels simultaneously. For clean on-chip
power distribution at high frequency, 14 VCC and
18 VSS pins separately feed functional units of the
Am386SX/SXL/SXLV CPU.
Power and ground connections must be made to all ex-
ternal VCC and VSS pins of the Am386SX/SXL/SXLV
CPU. On the circuit board, all VCC pins should be con-
nected on a VCC plane, and VSS pins should be con-
nected on a GND plane.
Power Decoupling Recommendations
Liberal decoupling capacitors should be placed near
the Am386SX/SXL/SXLV CPU. The Am386SX/SXL/
SXLV CPU driving its 24-bit address bus and 16-bit
data bus at high frequencies can cause transient power
surges, particularly when driving large capacitive
loads. Low inductance capacitors and interconnects
are recommended for best high frequency electrical
performance. Inductance can be reduced by shorten-
ing circuit board traces between the Am386SX/SXL/
SXLV CPU and decoupling capacitors as much as pos-
sible.
Resistor Recommendations
The ERROR, FLT, and BUSY inputs have internal pull-
up resistors of approximately 20 Kohms, and the
PEREQ input has an internal pull-down resistor of ap-
proximately 20 Kohms, built into the Am386SX/SXL/
SXLV CPU to keep these signals inactive when a
387SX-compatible math coprocessor is not present in
the system (or temporarily removed from its socket).
In typical designs, the external pull-up resistors shown
in Table 1 are recommended. However, a particular de-
sign may have reason to adjust the resistor values rec-
ommended here, or alter the use of pull-up resistors in
other ways.
Other Connection Recommendations
For reliable operation, always connect unused inputs to
an appropriate signal level. NC pins should always re-
main unconnected. Connection of NC pins to VCC or
VSS will result in component malfunction or incompati-
bility with future steppings of the Am386SX/SXL/SXLV
CPU.
Particularly when not using the interrupts or bus hold
(as when first prototyping), prevent any chance of spu-
rious activity by connecting these associated inputs to
GND:
Pin
Signal
40
INTR
38
NMI
4HOLD
If not using address pipelining, connect pin 6 (NA)
through a pull-up in the range of 20 Kohms to VCC.
Table 1.
Recommended Resistor Pull-Ups to VCC
Pin
Signal
Pull-Up Value
Purpose
16
ADS
20 Kohms ± 10%
Lightly pull ADS inactive during Am386SX/SXL/SXLV
CPU Hold Acknowledge states.
26
LOCK
20 Kohms ± 10%
Lightly pull LOCK inactive during Am386SX/SXL/
SXLV CPU Hold Acknowledge states.



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