 2017 Microchip Technology Inc.

DS20005724A-page 19

TC6321

Microchip Technology Drawing C04-413A Sheet 2 of 2

Number of Terminals

Overall Height

Terminal Width

Overall Width

Terminal Length

Exposed Pad Width (X2)

Terminal Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

b

E2

A3

e

L

E

N

1.27 BSC

0.20 REF

3.15

0.55

0.35

0.80

0.00

0.40

0.60

3.25

0.85

0.02

5.00 BSC

MILLIMETERS

MIN

NOM

8

3.35

0.65

0.45

0.90

0.05

MAX

K4

0.60 REF

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

3.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Package is saw singulated

Dimensioning and tolerancing per ASME Y14.5M

Exposed Pad to Exposed Pad

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Overall Length

Exposed Pad Length (X2)

D

D2

2.25

6.00 BSC

2.35

2.45

8-Lead Very Thin Plastic Dual Flat, No Lead (9U) - 6x5 mm Body [VDFN]

With Dual Exposed Pads

Molded Package Edge to Exposed Pad

K3

0.35 REF

Terminal to Exposed Pad (X4)

K2

0.20 REF

Terminal to Exposed Pad (X4)

K1

0.35 REF