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PLM393LVDR Arkusz danych(PDF) 6 Page - Texas Instruments |
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PLM393LVDR Arkusz danych(HTML) 6 Page - Texas Instruments |
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6 / 29 page ![]() 6 LM393LV-Q1 SNOSDB3 – JUNE 2020 www.ti.com Product Folder Links: LM393LV-Q1 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information, LM393LV THERMAL METRIC (1) LM393LV-Q1 UNIT D (SOIC) PW (TSSOP) 8 pin 8 pin RqJA Junction-to-ambient thermal resistance 167.7 221.7 °C/W RqJC(top) Junction-to-case (top) thermal resistance 107.0 109.1 °C/W RqJB Junction-to-board thermal resistance 111.2 152.5 °C/W yJT Junction-to-top characterization parameter 53.1 36.4 °C/W yJB Junction-to-board characterization parameter 110.4 150.7 °C/W RqJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W |
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