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LP1130 Arkusz danych(PDF) 3 Page - Lowpower Semiconductor inc

Numer części LP1130
Szczegółowy opis  Half-Bridge IPM
PDF  5 Pages
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Producent  POWER [Lowpower Semiconductor inc]
Strona internetowa  http://www.lowpowersemi.com
Logo POWER - Lowpower Semiconductor inc

LP1130 Arkusz danych(HTML) 3 Page - Lowpower Semiconductor inc

  LP1130 Datasheet HTML 1Page - Lowpower Semiconductor inc LP1130 Datasheet HTML 2Page - Lowpower Semiconductor inc LP1130 Datasheet HTML 3Page - Lowpower Semiconductor inc LP1130 Datasheet HTML 4Page - Lowpower Semiconductor inc LP1130 Datasheet HTML 5Page - Lowpower Semiconductor inc  
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LP1130-01
Apr.-2018
Email: marketing@lowpowersemi.com
www.lowpowersemi.com
Page 3 of 5
Preliminary Datasheet
LP1130
Function Diagram
OTP
UVLO
LOGIC
Anti-Cross
Conduction
VCC
PWM
EN
BST
SWN
PGND
VCC
VIN
Absolute Maximum Ratings
VCC ----------------------------------------------------------------------------------------------------------------- -0.3V to 15V
VIN ------------------------------------------------------------------------------------------------------------------- -0.3V to 30V
BST
--------------------------------------------------------------------------------------------------------------- -0.3V to 35V
BST to SWN ------------------------------------------------------------------------------------------------------ -0.3V to 15V
SWN ------------------------------------------------------------------------------------------------------------------- -5V to 20V
EN,PWM ---------------------------------------------------------------------------------------------------------- -0.3V to 6.5V
Maximum Junction Temperature ------------------------------------------------------------------------------------ 160℃
Maximum Soldering Temperature (at leads,10 sec) ----------------------------------------------------------- 260℃
Storage Temperature --------------------------------------------------------------------------------------- -55℃ to 165℃
Operating Ambient Temperature Range -------------------------------------------------------------- -40℃ to 85℃
Note1：All voltages are with respect to PGND except where noted.
Note2：Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Note3: This device is ESD sensitive. Use standard ESD precautions when handling.
Thermal Information
Package Thermal Resistance (Note4)
Maximum Power Dissipation (PD,TA=25℃) ------------------------------------------------------------------------ 1.5W
Junction to Ambient, θJA----------------------------------------------------------------------------------------------- 80℃/W
Note4：2 layer board, 1 in2 Cu, 1 oz thickness.



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