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LP4065AB6F Arkusz danych(PDF) 4 Page - Lowpower Semiconductor inc |
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LP4065AB6F Arkusz danych(HTML) 4 Page - Lowpower Semiconductor inc |
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4 / 8 page ![]() LP4065-00 Aug.-2018 Email: marketing@lowpowersemi.com www.lowpowersemi.com Page 4 of 8 Preliminary Datasheet LP4065 Absolute Maximum Ratings Note 1 Input Voltage to GND ---------------------------------------------------------------------------------------- -0.3V to 28V BAT Voltage GND ----------------------------------------------------------------------------------------------- - 5V to 7V Other pin to GND -------------------------------------------------------------------------------------------- -0.3V to 6.5V Maximum Junction Temperature ---------------------------------------------------------------------------------- 125℃ Maximum Soldering Temperature (at leads, 10 sec) --------------------------------------------------------- 260℃ Operating Junction Temperature Range (TJ) -------------------------------------------------------- -20℃ to 85℃ Storage Temperature ------------------------------------------------------------------------------------ -65℃ to 165℃ Thermal Information Maximum Power Dissipation ( PD,TA=25°C) --------------------------------------------------------------------- 0.6W Thermal Resistance (θJA) ---------------------------------------------------------------------------------------- 200℃/W ESD Susceptibility HBM(Human Body Mode) --------------------------------------------------------------------------------------------- 2KV MM(Machine Mode) ---------------------------------------------------------------------------------------------------- 200V Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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