10

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

10.1

Ultra thin WLCSP4 package information

Wafer back side

Side view

Orientation

reference

(4X)

aaa

E

D

X

Y

Detail A

bbb Z

A2

A

Bump

A1

Z

Detail A

Rotated 90 °

eee Z

b (4X)

e1

G

G

F

e

Seating plane

Orientation

reference

X Y

Ø

ddd M

Z

Ø

ccc M

Z

F

1.

Drawing is not to scale.

2.

Primary datum Z and seating plane are defined by the spherical crowns of the bump.

M24128X-FCU

Package information

DS12680 - Rev 2

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