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AF31 Arkusz danych(PDF) 3 Page - 3M Electronics

Numer części AF31
Szczegółowy opis  3M Scotch-WeldTM Structural Adhesive Film
PDF  15 Pages
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Producent  3M [3M Electronics]
Strona internetowa  http://www.3m.com
Logo 3M - 3M Electronics

AF31 Arkusz danych(HTML) 3 Page - 3M Electronics

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Scotch-WeldTM
Structural Adhesive Film
AF 31
- 3 -
2. 3M™ Scotch-Weld™ Structural Adhesive Film AF 31/3M™ Scotch-Weld™ Structural Adhesive
Primer EC-2174 Overlap Shear on Aluminum
The following data shows typical values obtained with Scotch-Weld AF 31 film adhesive over Scotch-Weld
EC-2174 primer in overlap bonds. All properties were measured on 1" wide 1/2" overlap specimens cut from
.063" thick 4" x 7" bonded panels of 2024 T3 clad aluminum. Tests were conducted according to MMM-A-
132 methods. All data reported in this section was developed using the following cures.
Product Performance
(continued)
Note: The following technical information and data should be considered representative
or typical only and should not be used for specification purposes.
Scotch-Weld AF 31/Scotch-Weld EC-2174
Test
350°F (177°C) for 120 min.
350°F (177°C) for 60 min.
Test
Temperature
100 psi 10°F rise rate/min.
45 psi 10°F rise rate/min.
Shear Strength
-67°F ± 2°F (-55°C ± 1°C)
2750 psi
2310 psi
73.5°F ± 2°F (23°C ± 1°C)
4430 psi
4070 psi
260°F ± 2°F (127°C ± 1°C)
2700 psi
300°F ± 2°F (149°C ± 1°C)
2550 psi
2330 psi
350°F ± 2°F (177°C ± 1°C)
2350 psi
Creep Rupture
73.5°F ± 2°F (23°C ± 1°C)
.003"
(192 hours)
300°F ± 2°F (149°C ± 1°C)
.006"
3. Scotch-Weld AF 31 Film Adhesive T-Peel on Aluminum
T-Peel bonds consist of bonded areas of 1" x 6" 2024 T3 clad 1" x 8" x .032" panels with one layer of Scotch-
Weld AF 31 film adhesive. Each metal skin of the T-Peel panels were pulled at a 90° angle to the bond line or
180° in relation to themselves with a jaw separation rate of 20 inches per minute.
A. Original Properties
T-Peel (lbs./inch width)
-40°F
75°F
180°F
250°F
350°F
450°F
Cure Cycle
(-40°C)
(24°C)
(82°C)
121°C
(177°C)
(232°C)
350°F (177°C), 60 min., 150 psi, 200°F
4
25
12
8
7
4
(93°C) per min. rise rate to cure
temperature.
450°F (232°C) press temperature, 350 psi,
4
27
11
8
7
4
15 seconds in the press, maximum bond
line temperature attained 412°F (211°C).



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