F2913 Datasheet

© 2019 Integrated Device Technology, Inc.

7

January 31, 2019

Thermal Characteristics

Table 6.

Package Thermal Characteristics

Parameter

Symbol

Value

Units

Junction to Ambient Thermal Resistance

60.2

°C/W

Junction to Case Thermal Resistance

(Case is defined as the exposed paddle)

9.5

°C/W

Moisture Sensitivity Rating (Per J-STD-020)

MSL1

Typical Operating Conditions (TOCs)

Unless otherwise noted:











Small signal tests done at 0dBm input power.



+13dBm per tone for IIP3 measurements.



RF1 or RF2 are the driven ports.



Evaluation Kit traces and connector losses are de-embedded for the insertion loss and isolation plots. All other plots include the loss and

effects of the PCB.